Call for Papers

International Conference on Artificial Intelligence in China (CHINAAI)

July 20-22, 2019, Urumqi, China

Sponsored by:

College of Artificial Intelligence, Tianjin Normal University

China Institute of New Generation Artificial Intelligence Development Strategies

IEEE Fort Worth Section, USA

IEEE Women in Engineering of Harbin Section, China

University of Texas at Arlington, USA

University of Strathclyde, UK

Tianjin Normal University, China

Xinjiang Normal University, China

Harbin Institute of Technology, China

Dalian University of Technology, China

Dalian Maritime University, China

Lanzhou Jiaotong University, China

University of Electronic Science and Technology, China

Beijing University of Posts and Telecommunications, China

Shanghai Jiaotong University, China

Nankai University, China

Nazarbayev University, Kazakhstan

The International Conference on Artificial Intelligence in China (ChinaAI) will be held in July 2019 in Urumqi, China. Prospective authors are invited to submit original technical papers for oral or poster presentations at ChinaAI and publication in the Conference Proceedings. The papers in Artificial Intelligence are solicited in the following topics, but are not limited to:

· Deep Learning and Neural Networks

· Machine Learning

· Computer Vision

· Knowledge Representation and Reasoning

· Probabilistic Reasoning

· Statistical Learning

· Reinforcement Learning

· Decision Making

· Fuzzy Systems

· Evolutionary Computing

· Perception

· Inference and Prediction

· Human-Inspired Learning and Computing

· Autonomous Vehicle

· Data Mining

· Spoken Language Processing

· Pattern Analysis and Recognition

· Robotics

· AI for Sensing

· AI for Communications

· AI for Internet of Things

· AI for Signal Processing

· AI for Education

· AI for Healthcare

· AI for Other Applications

All accepted papers will be published in Lecture Notes in Electrical Engineering (LNEE), a book series published by Springer, and is indexed by EI-indexed, ISI Proceedings, SCOPUS, MetaPress, Springerlink.

All submissions should be written in English with a maximum paper length of eight (8) printed pages including figures without incurring additional page charges.

Standard Springer book templates are available for both LaTeX and Microsoft Word format. Please note that Springer book template size is much smaller than that of IEEE template (almost half size).

Only PDF files will be accepted for the review process and all submissions must be carried out through EasyChair.

Authors can use the link below for submission:

https://easychair.org/conferences/?conf=chinaai2019

Important Dates:

Paper Submission Deadline: April 20th, 2019 June 20th, 2019

Acceptance Notification: June 30th, 2019

Camera Ready Paper: July 10th, 2019

Keynote speakers include internationally renowned authorities:

Jianguo Jia Huawei R&D Centre Shanghai

Ke Gong Nankai University

Jianhua Lu Tsinghua University

Fei Wu Zhejiang University

Honggang Zhang Zhejiang University

General Co-Chairs:

Tariq S. Durrani, University of Strathclyde, UK

Yubao Gao, Tianjin Normal University, China

Ke Gong, Nankai University, China

TPC Co-Chairs:

Weimin Pan, Xinjiang Normal University, China

Qilian Liang, University of Texas at Arlington, USA

Bingcai Chen, Xinjiang Normal University, China

Qian Ning, Sichuan University, China

Dongmei Xie, Tianjin University, China

Alex Papachen James, Nazarbayev University, Kazakhstan

Jun Zhang, Dalian Maritime University, China

Min Jia, Harbin Institute of Technology, China

Xin Liu, Dalian University of Technology, China

Zhenyu Na, Dalian Maritime University, China

Xiaoqiang Chen, Lanzhou Jiaotong University, China

Baoju Zhang， Tianjin Normal University， China

Wei Wang, Tianjin Normal University, China

Jing Liang, University of Electronic Science and Technology, China

Zan Li, Xidian University, China

Qihui Wu, Nanjing University of Aeronautics and Astronautics, China

Qinyu Zhang，Harbin Institute of Technology, China

International Advisory Committee

Jerry Mendel, University of Southern California, USA

Victor C.M. Leung, University of British Columbia, Canada

Kat-Kit Wong, University College London, UK

Gene Frantz, Texas Instruments, USA

Er Meng Hwa, Nanyang Technological University, Singapore

Zhisheng Niu, Tsinghua University, China

Qing Guo,Harbin Institute of Technology

Jianwei Ma, Harbin Institute of Technology

Wan-Chi Siu, Hong Kong Polytechnic University, Hong Kong

Arumugam Nallanathan, King’s College London, UK

Baoju Zhang, Tianjin Normal University, China

Jean Gao, University of Texas at Arlington, USA

International Liaisons:

Sheila M Forbes，University of Strathclyde, UK

Publication Co-Chairs:

Yue Wang, Tianjin Normal University, China

YulongZou, Nanjing University of Posts and Telecommunications, China

Hui Li, Hainan University, China

Guoru Ding, Southeast University, China

Xiaoming Chen, Zhejiang University, China

Yueling Che, Shenzhen University, China

Su Hu, University of Electronic Science and Technology of China, China

Xinlin Huang, Tongji University, China

Yun Lin, Harbin University of Engineering, China

Jie Tang, South China University of Technology, China

Chungang Yang, Xidian University, China

Feng Shu, Nanjing University of Science and Technology, China

Qinghe Du, Xi'an Jiaotong University, China

Wei Wang, Zhejiang University, China

Publicity Co-Chair:

Guan Gui, Nanjing University of Posts and Telecommunications, China

Liang Xiao, Xiamen University, China

Xiaopeng Yang, Beijing Institute of Technology, China

Gongliang Liu, Harbin Institute of Technology (Weihai), China

Haijun Zhang, University of Science & Technology Beijing, China

Qingquan Sun, California State University San Bernardino, USA

Xiaofei Zhang, Nanjing University of Aeronautics and Astronautics, China

Zilong Liu, Nanyang Technological University, Singapore

Yuan Zhou, Tianjin University, China

Yong Li, Tsinghua University, China

Jingjiang Wang, Qingdao University of Science and Technology, China

Ning Wang, Zhengzhou University, China

YunjianJia, Chongqing University, China

Qingjiang Shi, Nanjing University of Aeronautics and Astronautics, China

Keynote Co-Chairs

Jean X. Gao, University of Texas at Arlington, USA

Shenghong Li, Shanghai Jiaotong University, China

Haibo Zhou, Naijing University, China

Lei Chen, Georgia Southern University, USA

Weijie Xia, Nanjing University of Aeronautics and Astronautics, China

Yong Zeng, National University of Singapore, Singapore

Tingting Zhang, Harbin Institute of Technology (Shenzhen), China

Jun Li, Nanjing University of Science and Technology, China

Jingyu Hua, Zhejiang University of Technology, China

Weigang Chen, Tianjin University, China

Rong Chai, Chongqing University of Posts and Telecommunications

Lusheng Wang, HeFei University of Technology, China

Yanjing Sun, China University of Mining and Technology, China

Rongfei Fan, Beijing Institute of Technology, China

Local Arrangement Co-Chairs:

Mei Nian, Xinjiang Normal University, China

Zhiming Ma, Xinjiang Normal University, China

Yong Yang, Xinjiang Normal University, China

Minglu Jin, Dalian University of Technology, China

Nan Zhao, Dalian University of Technology, China

Xufen Xie, Dalian Polytechnic University, China

Jie wang, Dalian University of Technology, China

Hui Li, Dalian University of Technology, China

Registration & Financial Co-Chairs:

Xiangwei Qi, Xinjiang Normal University, China

Haifang Li, Xinjiang Normal University, China

Zhuo Sun, Beijing University of Posts and Telecommunications, China

Liang Han, Tianjin Normal University, China

Xiaonan Zhao, Tianjin Normal University, China

Yue Wang, Tianjin Normal University , China

Yi Sun, Dalian University of Technology, China

Yanqing Guo, Dalian University of Technology, China

Ming Li, Dalian University of Technology, China

Bo Wang, Dalian University of Technology, China